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  "path": "/news/111240-qualcomm-may-borrow-samsung-cooling-tech-next-snapdragon.html",
  "publishedAt": "2026-02-08T15:13:00.000Z",
  "site": "https://www.techspot.com",
  "tags": [
    "Read Entire Article"
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  "textContent": "\nThe Heat Pass Block first appeared in Samsung's 2nm Exynos 2600, reportedly delivering a 16 percent improvement in thermal resistance. It's a copper-based layer built directly onto the processor die, providing a direct pathway for heat to dissipate before it can radiate through surrounding components.\n\nRead Entire Article\n\n",
  "title": "Qualcomm may borrow Samsung's cooling tech for its next Snapdragon flagship"
}