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  "path": "/releases/2026/05/260530053412.htm",
  "publishedAt": "2026-05-30T06:26:24.000Z",
  "site": "https://www.sciencedaily.com",
  "textContent": "As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ultra-thin silicon membranes and low-temperature manufacturing techniques to overcome a major obstacle that has long blocked the production of true 3D chips.",
  "title": "New 3D silicon chip breakthrough could extend Moore’s Law for years"
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