{
  "$type": "site.standard.document",
  "description": "An embodiment provides a printed circuit board and an electronic component package including the same, the printed circuit board comprising: a data line layer; a ground layer disposed on the data line layer; a power line layer disposed on the ground layer; and insulation layers disposed between the…",
  "path": "/patents/1235289",
  "publishedAt": "2019-05-30T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H05K1/023",
    "LG INNOTEK CO., LTD."
  ],
  "textContent": "An embodiment provides a printed circuit board and an electronic component package including the same, the printed circuit board comprising: a data line layer; a ground layer disposed on the data line layer; a power line layer disposed on the ground layer; and insulation layers disposed between the data line layer and the ground layer and between the ground layer and the power line layer, respectively, wherein the ground layer comprises a common ground and a chassis ground electrically insulated from the common ground.",
  "title": "PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE INCLUDING SAME"
}