{
  "$type": "site.standard.document",
  "description": "Provided is an electronic control device that can reduce a usage amount of an adhesive constituting a seal member, by relieving a stress caused in the seal member disposed in a gap between a first housing part and a second housing part in a high-temperature environment. In an electronic control…",
  "path": "/patents/1244843",
  "publishedAt": "2019-10-03T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60R16/02",
    "Hitachi Automotive Systems, Ltd."
  ],
  "textContent": "Provided is an electronic control device that can reduce a usage amount of an adhesive constituting a seal member, by relieving a stress caused in the seal member disposed in a gap between a first housing part and a second housing part in a high-temperature environment. In an electronic control device including: a component mounting board mounted with an electronic component; and a first housing part and a second housing part that are fixed to each other via a seal member and define a first space that accommodates the component mounting board, at least one predetermined housing part of the first or second housing part has a recess formed on a surface facing the seal member, and a second space is formed between the recess and the seal member.",
  "title": "Electronic Control Device and Assembly Method Thereof"
}