{
  "$type": "site.standard.document",
  "description": "Embodiments describe a housing for an electronic device that includes a non-conductive filament wound around a least a first portion of a perimeter of the housing, and a conductive filament wound around a least a second portion of the perimeter of the housing. The non-conductive filament and the…",
  "path": "/patents/1249200",
  "publishedAt": "2019-11-28T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H02J50/10",
    "Apple Inc."
  ],
  "textContent": "Embodiments describe a housing for an electronic device that includes a non-conductive filament wound around a least a first portion of a perimeter of the housing, and a conductive filament wound around a least a second portion of the perimeter of the housing. The non-conductive filament and the conductive filament are adhered together to form the housing",
  "title": "WOUND HOUSINGS FOR ELECTRONIC DEVICES"
}