{
  "$type": "site.standard.document",
  "description": "A microstrip antenna for use in a wireless power transmission system and a method for forming the microstrip antenna are described. The antenna includes a first multi-layer printed circuit board (PCB) that includes a top surface and a bottom surface. The top and bottom surfaces of the first…",
  "path": "/patents/1259026",
  "publishedAt": "2020-04-09T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H02J50/23",
    "Energous Corporation"
  ],
  "textContent": "A microstrip antenna for use in a wireless power transmission system and a method for forming the microstrip antenna are described. The antenna includes a first multi-layer printed circuit board (PCB) that includes a top surface and a bottom surface. The top and bottom surfaces of the first multi-layer PCB include a first electrically conductive material. The antenna includes a second multi-layer PCB that includes a top surface and a bottom surface. The top and bottom surfaces of the second multi-layer PCT include a second electrically conductive material. A first plurality of vias each substantially pass through the top and bottom surfaces of the first multi-layer PCB. A second plurality of vias each substantially pass through the top and bottom surfaces of the second multi-layer PCB. The antenna further comprises a dielectric slab that is configured to receive the first multi-layer PCB and the second multi-layer PCB.",
  "title": "MICROSTRIP ANTENNAS FOR WIRELESS POWER TRANSMITTERS"
}