{
  "$type": "site.standard.document",
  "description": "An MMC converter linked to a HVDC system and a sub-module are proposed. The sub-module includes: first and second power semiconductor switches serially connected in the same direction, each including a semiconductor switch and a diode connected in anti-parallel to the semiconductor switch; a…",
  "path": "/patents/1259578",
  "publishedAt": "2020-04-16T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H02J3/36",
    "HYOSUNG HEAVY INDUSTRIES CORPORATION"
  ],
  "textContent": "An MMC converter linked to a HVDC system and a sub-module are proposed. The sub-module includes: first and second power semiconductor switches serially connected in the same direction, each including a semiconductor switch and a diode connected in anti-parallel to the semiconductor switch; a capacitor parallelly connected to the first and second power semiconductor switches serially connected; a first terminal connected to a first node between the first and second power semiconductor switches; a second terminal connected to a second node between the second power semiconductor switch and the capacitor; a third power semiconductor switch of which a side is connected to the second node, the third power semiconductor switch including a semiconductor switch and a diode connected in anti-parallel to the semiconductor switch; and a third terminal connected to a terminal of an AC grid system and connected to the other side of the third power semiconductor switch.",
  "title": "MMC CONVERTER AND SUB-MODULES THEREOF"
}