{
  "$type": "site.standard.document",
  "description": "A hybrid printed circuit board and a battery pack including the same are disclosed. A hybrid printed circuit board includes: a flexible printed circuit board including a flexible film that is bendable, and a flexible conductive layer stacked on the flexible film, the flexible printed circuit board…",
  "path": "/patents/1435467",
  "publishedAt": "2026-07-02T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H05K1/0209",
    "SAMSUNG SDI CO., LTD."
  ],
  "textContent": "A hybrid printed circuit board and a battery pack including the same are disclosed. A hybrid printed circuit board includes: a flexible printed circuit board including a flexible film that is bendable, and a flexible conductive layer stacked on the flexible film, the flexible printed circuit board including a bending part located on a first side and a heat dissipation promoting part located on a second side; and a heat dissipation printed circuit board overlapping the heat dissipation promoting part and electrically connected to the flexible conductive layer.",
  "title": "HYBRID PRINTED CIRCUIT BOARD AND BATTERY PACK INCLUDING THE SAME"
}