{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
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    "mimeType": "image/png",
    "size": 101296
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  "description": "Provided is a semiconductor device including: a circuit board; a wiring pattern; a first semiconductor chip and a second semiconductor chip; a first lead frame; and a second lead frame; wherein the first lead frame and the second lead frame each comprises: a chip joining portion provided above at…",
  "path": "/patents/1281301",
  "publishedAt": "2021-01-14T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01L23/528",
    "FUJI ELECTRIC CO., LTD."
  ],
  "textContent": "Provided is a semiconductor device including: a circuit board; a wiring pattern; a first semiconductor chip and a second semiconductor chip; a first lead frame; and a second lead frame; wherein the first lead frame and the second lead frame each comprises: a chip joining portion provided above at least a part of the semiconductor chip; a wiring joining portion provided above at least a part of the wiring pattern; and a bridging portion for connecting the chip joining portion and the wiring joining portion; and in the first direction, a space between the bridging portion of the first lead frame and the bridging portion of the second lead frame is smaller than a space between the chip joining portion of the first lead frame and the chip joining portion of the second lead frame.",
  "title": "SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND VEHICLE"
}