{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
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  "description": "A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first…",
  "path": "/patents/1281431",
  "publishedAt": "2021-01-14T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H05K3/341",
    "ITM SEMICONDUCTOR CO., LTD."
  ],
  "textContent": "A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection, forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame, and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.",
  "title": "BATTERY PROTECTION CIRCUIT PACKAGE AND METHOD OF FABRICATING THE SAME"
}