THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE MEMBER, AND HEAT-DISSIPATING STRUCTURE

PROBLEMTo provide a thermally conductive composition that has extremely high thermal conductivity, excellent extrusion workability and filling properties into small-volume packages, as well as a thermally conductive member made thereof, and a heat dissipation structure using the same.SOLUTIONA thermally conductive composition, comprising: (A) zinc oxide powder/aluminum oxide powder having a particle size of 0.1 to 1.0 µm; (B) aluminum nitride powder/aluminum oxide powder having an irregular shape or the like having a particle size of 2.0 to 29 µm; (C) aluminum nitride powder having an irregular shape or the like having a particle size of 30 µm or more; (D) spherical aluminum nitride powder having a particle size of more than 50 µm; (E) a specific Si-based surface treatment agent; and (F) a matrix polymer, wherein the amount of components (A) to (D) are in the range of 60 to 90 vol.%, based on the total solid content of the composition; the amount of component (C) is in a range of 1.0 to 20.0 vol.%; and the amount of component (D) is in a range of 0.0 to 30.0 vol.%; as well as use thereof.