{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
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    "mimeType": "image/png",
    "size": 115953
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  "description": "An electronic device includes a substrate, a functional element disposed on a principal plane of the substrate, a lid body, the functional element being housed in a space covered by the lid body and the substrate, the lid body including a recess at a side opposed to the functional element, an outer…",
  "path": "/patents/1282235",
  "publishedAt": "2021-01-28T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G01P1/026",
    "Seiko Epson Corporation"
  ],
  "textContent": "An electronic device includes a substrate, a functional element disposed on a principal plane of the substrate, a lid body, the functional element being housed in a space covered by the lid body and the substrate, the lid body including a recess at a side opposed to the functional element, an outer surface at the opposite side of the recess, a first hole section including an inclined surface and a bottom surface on the outer surface, and a second hole section piercing through the lid body between the recess and the bottom surface and having an inner wall surface, a joining section of the inclined surface and the bottom surface in the first hole section being a curved surface, the lid body containing silicon, and a sealing member that seals the first hole section communicating with the space.",
  "title": "Electronic Device, Manufacturing Method For Electronic Device, Electronic Apparatus, And Vehicle"
}