{
  "$type": "site.standard.document",
  "description": "An integrated cooling module includes a plate-shaped manifold and multiple cooling components mounted thereon. The manifold includes stacked first and second plates that form a first refrigerant channel recessed along a line structure of the first plate, while the second plate provides a flat…",
  "path": "/patents/1425145",
  "publishedAt": "2026-06-23T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "F28D1/05391",
    "HANON SYSTEMS"
  ],
  "textContent": "An integrated cooling module includes a plate-shaped manifold and multiple cooling components mounted thereon. The manifold includes stacked first and second plates that form a first refrigerant channel recessed along a line structure of the first plate, while the second plate provides a flat sealing surface. A third plate can be further stacked to form a second refrigerant channel, and through-holes in the second plate allow communication between channels. Ports formed in the plates enable direct connection with external components. A condenser, chiller, expansion valve, pressure/temperature sensor, and an accumulator may be mounted on the manifold, which is arranged perpendicular to a bottom surface.",
  "title": "Integrated cooling module"
}