{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
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  "description": "A power control unit is disposed on a transaxle case and includes: a plurality of semiconductor devices; an electronic circuit board including a soldered portion for attaching the plurality of semiconductor devices; and a PCU case formed to house the plurality of semiconductor devices and the…",
  "path": "/patents/1284469",
  "publishedAt": "2021-02-25T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H05K5/0217",
    "TOYOTA JIDOSHA KABUSHIKI KAISHA"
  ],
  "textContent": "A power control unit is disposed on a transaxle case and includes: a plurality of semiconductor devices; an electronic circuit board including a soldered portion for attaching the plurality of semiconductor devices; and a PCU case formed to house the plurality of semiconductor devices and the electronic circuit board. The PCU case includes a support member to which the plurality of semiconductor devices are attached, and an upper cover forming at least a part of an upper surface of the PCU case. The upper cover includes a first component and one or more second components having a lower rigidity than the first component. The electronic circuit board is attached to the first component. The soldered portion is arranged on a surface of the electronic circuit board on the upper cover side. At least one of the one or more second components is arranged to cover the soldered portion.",
  "title": "POWER CONTROL UNIT AND METHOD OF ASSEMBLING THE SAME"
}