{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
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  "description": "According to an embodiment of the present disclosure, provided is a method for manufacturing a bus bar in which a frame including a sensing part and a body part connected to the sensing part is prepared, the frame is inserted into and fixed to an injection molding mold, and an enhanced part…",
  "path": "/patents/1285733",
  "publishedAt": "2021-03-18T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B29C45/14336",
    "DAE SAN ELECTRONICS CO., LTD."
  ],
  "textContent": "According to an embodiment of the present disclosure, provided is a method for manufacturing a bus bar in which a frame including a sensing part and a body part connected to the sensing part is prepared, the frame is inserted into and fixed to an injection molding mold, and an enhanced part enhancing the strength at a position where fatigue is concentrated by an enhancing injection material injected into the injection molding mold is formed in the frame.",
  "title": "METHOD FOR MANUFACTURING BUSBAR AND MANUFACTURING BUSBAR THROUGH THE SAME"
}