{
  "$type": "site.standard.document",
  "description": "A method of manufacturing a component for a reference electrode assembly according to various aspects of the present disclosure includes providing a separator having first and second opposing surfaces. The method further includes sputtering a first current collector layer to the first surface via…",
  "path": "/patents/1286744",
  "publishedAt": "2021-03-25T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M4/0426",
    "GM GLOBAL TECHNOLOGY OPERATIONS LLC"
  ],
  "textContent": "A method of manufacturing a component for a reference electrode assembly according to various aspects of the present disclosure includes providing a separator having first and second opposing surfaces. The method further includes sputtering a first current collector layer to the first surface via magnetron or ion beam sputtering deposition. A porosity of the separator is substantially unchanged by the sputtering. In one aspect, the method further includes sputtering a second current collector layer to the second surface via magnetron or ion beam sputtering deposition. In one aspect, the first current collector layer includes nickel and defines a first thickness of greater than or equal to about 200 nm to less than or equal to about 300 nm and the second current collector layer includes gold and defines a second thickness of greater than or equal to about 25 nm to less than or equal to about 100 nm.",
  "title": "REFERENCE ELECTRODE ASSEMBLIES INCLUDING THIN, POROUS CURRENT COLLECTORS AND METHODS OF MANUFACTURING THIN, POROUS CURRENT COLLECTORS"
}