{
  "$type": "site.standard.document",
  "description": "An MMC converter linked to a HVDC system and a sub-module constituting the MMC converter are proposed. The sub-module includes: first and second power semiconductor switches connected in series in the same direction, each including a semiconductor switch and a diode connected in anti-parallel to…",
  "path": "/patents/1291009",
  "publishedAt": "2021-05-20T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H02M7/483",
    "HYOSUNG HEAVY INDUSTRIES CORPORATION"
  ],
  "textContent": "An MMC converter linked to a HVDC system and a sub-module constituting the MMC converter are proposed. The sub-module includes: first and second power semiconductor switches connected in series in the same direction, each including a semiconductor switch and a diode connected in anti-parallel to the semiconductor switch; a capacitor connected in parallel to the first and second power semiconductor switches connected together in series; a first terminal connected to a first node between the first and second power semiconductor switches; a second terminal connected to a second node between the second power semiconductor switch and the capacitor; third and fourth power semiconductor switches connected in series in opposite directions between the first and second terminals, each including a semiconductor switch and a diode connected in anti-parallel to the semiconductor switch; and a third terminal connected to a third node between the third and fourth power semiconductor switches.",
  "title": "MODULAR MULTILEVEL CONVERTER AND SUB-MODULE THEREOF"
}