{
  "$type": "site.standard.document",
  "description": "Embodiments of this application disclose a thermal management apparatus, a thermal management system, and a new energy vehicle, to perform thermal management on an electronic device and meet both a heat dissipation requirement and a thermal insulation requirement of the electronic device. The…",
  "path": "/patents/1415595",
  "publishedAt": "2024-03-20T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M10/486",
    "HUAWEI TECH CO LTD [CN]"
  ],
  "textContent": "Embodiments of this application disclose a thermal management apparatus, a thermal management system, and a new energy vehicle, to perform thermal management on an electronic device and meet both a heat dissipation requirement and a thermal insulation requirement of the electronic device. The thermal management apparatus includes a first loop in which a first solenoid valve, a first liquid cooling plate, a second solenoid valve, and a second liquid cooling plate are sequentially connected in series, and a thermal insulation structure. The second liquid cooling plate, the thermal insulation structure, and the first liquid cooling plate are sequentially stacked. The first liquid cooling plate can perform heat transfer with the electronic device. When the first solenoid valve and the second solenoid valve are closed, the first liquid cooling plate communicates with the second liquid cooling plate. When the first solenoid valve and the second solenoid valve are open, the first liquid cooling plate and the second liquid cooling plate are disconnected.",
  "title": "THERMAL MANAGEMENT DEVICE, THERMAL MANAGEMENT SYSTEM AND NEW ENERGY VEHICLE"
}