{
  "$type": "site.standard.document",
  "description": "To provide a polyacetal resin composition and a molded article thereof, which are less likely to crack even if stressed in contact with any hydrochloric acid-containing liquid. The polyacetal resin composition contains, per 100 parts by mass of a polyacetal resin: 0.01 to 10 parts by mass of at…",
  "path": "/patents/1298920",
  "publishedAt": "2021-09-02T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "C08L59/00",
    "MITSUBISHI ENGINEERING-PLASTICS CORPORATION"
  ],
  "textContent": "To provide a polyacetal resin composition and a molded article thereof, which are less likely to crack even if stressed in contact with any hydrochloric acid-containing liquid. The polyacetal resin composition contains, per 100 parts by mass of a polyacetal resin: 0.01 to 10 parts by mass of at least one fatty acid metal salt selected from 1) to 3) below; and 0.1 to 5 parts by mass of a stress relaxant having a melting point of 67.5° C. to 200° C. when measured by using a differential scanning calorimeter at a flow rate of nitrogen of 20 cm/min and at a heating rate of 10° C./min.",
  "title": "POLYACETAL RESIN COMPOSITION, AND, MOLDED ARTICLE"
}