{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreicmsssooegj45bpsp6ubo2qmnp7wz3nlhhsm25uiit7zebc4exi7a"
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    "mimeType": "image/png",
    "size": 95773
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  "description": "A module assembly is attached on a headlining of a vehicle and includes a base where an upper portion thereof is open, a first printed circuit board (PCB) and a second PCB sequentially stacked on a plurality of supporting pillars extending in a vertical direction to an inner bottom surface of the…",
  "path": "/patents/1300247",
  "publishedAt": "2021-09-16T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H05K1/144",
    "HYUNDAI MOBIS Co., Ltd."
  ],
  "textContent": "A module assembly is attached on a headlining of a vehicle and includes a base where an upper portion thereof is open, a first printed circuit board (PCB) and a second PCB sequentially stacked on a plurality of supporting pillars extending in a vertical direction to an inner bottom surface of the base and electrically connected to each other by a flexible cable, and a cover assembled with the base to cover the first and second PCBs stacked on the base.",
  "title": "MODULE ASSEMBLY MOUNTED ON HEADLINING OF VEHICLE"
}