{
  "$type": "site.standard.document",
  "description": "The invention relates to a method for applying polymer patches, in particular from polymer electrode material, on a carrier substrate, including the following method steps: a) plasticizing the polymer electrode material to form a melt, b) feeding the plasticized polymer electrode material via at…",
  "path": "/patents/1301899",
  "publishedAt": "2021-10-07T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M4/602",
    "Collin Lab & Pilot Solutions GmbH"
  ],
  "textContent": "The invention relates to a method for applying polymer patches, in particular from polymer electrode material, on a carrier substrate, including the following method steps: a) plasticizing the polymer electrode material to form a melt, b) feeding the plasticized polymer electrode material via at least one die to a heated, structured roller or to a heated, structured conveyor belt, wherein the roller and/or the conveyor belt have recesses that correspond to the dimensions of the patches to be applied, c) applying the plasticized polymer electrode material on a carrier substrate by bringing the roller and/or the conveyor belt in contact with a carrier substrate.",
  "title": "Method For Applying Polymer Patches Onto A Substrate"
}