{
  "$type": "site.standard.document",
  "description": "Provided is a molding packaging material which is capable of ensuring good slipperiness to secure good formability when molding the molding packaging material and is less likely to cause white powder on a surface of the packaging material. The molding packaging material includes a substrate layer…",
  "path": "/patents/1304748",
  "publishedAt": "2021-11-25T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B32B15/085",
    "SHOWA DENKO PACKAGING CO., LTD."
  ],
  "textContent": "Provided is a molding packaging material which is capable of ensuring good slipperiness to secure good formability when molding the molding packaging material and is less likely to cause white powder on a surface of the packaging material. The molding packaging material includes a substrate layer as an outer layer, a heat fusible resin layer as an inner layer, and a metal foil layer arranged between the two layers. The heat fusible resin layer is composed of a single layer or a multi-layer. The innermost layer of the heat fusible resin layer is made of a resin composition containing a heat fusible resin, an anti-blocking agent, a slip agent, and a fluoropolymer-based lubricant.",
  "title": "MOLDING PACKAGING MATERIAL, POWER STORAGE DEVICE PACKAGING CASE, AND POWER STORAGE DEVICE"
}