{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreifc3wl62oe5imanfh4iubyef4kptg7qeq3e6jloiktke5h5x6qptq"
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    "mimeType": "image/png",
    "size": 97333
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  "description": "The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat…",
  "path": "/patents/1409570",
  "publishedAt": "2026-05-20T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H05K1/0203",
    "SOLUM CO LTD [KR]"
  ],
  "textContent": "The present invention relates to an electrical device including a printed circuit board (PCB) module accommodated in a case, and more particularly, to an electrical device having a heat dissipation structure using a filler that reduces heat generation outside a case while increasing a heat dissipation efficiency of a PCB module by using the filler filled in the case, and a manufacturing method of the same.",
  "title": "ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER"
}