Electrode lead for electrochemical device and electrochemical device including the same

The present disclosure relates to an electrode lead for an electrochemical device, including a nickel plating layer disposed on the surface of a metallic terminal, having a surface irregularity structure on the nickel plating layer, and including a polar group-containing coating layer. The present disclosure also relates to an electrochemical device including the electrode lead. The electrode lead for an electrochemical device provides increased binding force between the electrode lead and the lead film by increasing the contact area between the electrode lead and the lead film, while not causing damages upon the surface of the electrode lead.