{
  "$type": "site.standard.document",
  "description": "A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect…",
  "path": "/patents/1311545",
  "publishedAt": "2022-02-24T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G01C19/5783",
    "PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD."
  ],
  "textContent": "A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.",
  "title": "SENSOR DEVICE"
}