{
  "$type": "site.standard.document",
  "description": "A method for preparing a modular planar interconnect plate includes steps of a) providing a metal blank sheet having a main region and two first lateral regions, b) forming two openings respectively in the first lateral regions, and c) stamping to form protrusions and depressions at the main region…",
  "path": "/patents/1317794",
  "publishedAt": "2022-05-19T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B21D28/26",
    "National Taipei University of Technology"
  ],
  "textContent": "A method for preparing a modular planar interconnect plate includes steps of a) providing a metal blank sheet having a main region and two first lateral regions, b) forming two openings respectively in the first lateral regions, and c) stamping to form protrusions and depressions at the main region on lower and upper surfaces of the metal blank sheet. In the stamping step, each of two lower surrounding protrusions and two upper surrounding depressions is formed to surround a corresponding one of the openings, and each of an upper surrounding protrusion and a lower surrounding depression is formed to surround the corresponding ones of the protrusions and depressions formed at the main region and the first lateral regions.",
  "title": "METHOD FOR PREPARING MODULAR PLANAR INTERCONNECT PLATE"
}