MULTI-COMPONENT TYPE THERMALLY CONDUCTIVE SILICONE-GEL COMPOSITION, THERMALLY CONDUCTIVE MATERIAL AND HEAT-EMISSION STRUCTURE

Provided is a thermally conductive silicone gel composition having high thermal conductivity, excellent extrudability and mixing stability, resistance to separation of each liquid even in a two-component package, stable storage, and superior gap fill properties for heat dissipating components, and the like. A multi-component thermally conductive silicone gel composition comprises: (A-1) an alkenyl group-containing organopolysiloxane having a degree of polymerization of 5 to 100; (A-2) an alkenyl group-containing organopolysiloxane having a degree of polymerization of 400 or more; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane coupling agent, and the like; and (F) an organopolysiloxane having a hydrolyzable silyl group at the end of the molecular chain. A mixture viscosity of component (A-1) and component (A-2) is within a range of 1.15 to 5.50 times the viscosity of the component (A-1) at 25° C.