{
  "$type": "site.standard.document",
  "description": "The present disclosure provides a method of manufacturing a formed body for an electrode including: a step of preparing an electrode material containing an electrode active material; a step of supplying the electrode material onto the support; and a step of pressurizing the electrode material on…",
  "path": "/patents/1319175",
  "publishedAt": "2022-06-02T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M4/0435",
    "FUJIFILM CORPORATION"
  ],
  "textContent": "The present disclosure provides a method of manufacturing a formed body for an electrode including: a step of preparing an electrode material containing an electrode active material; a step of supplying the electrode material onto the support; and a step of pressurizing the electrode material on the support by sandwiching the support and the electrode material between a first roll that is brought into contact with the electrode material and a second roll that is brought into contact with the support, in which a temperature T1 of the first roll and a temperature T2 of the second roll satisfy a relationship T1>T2.",
  "title": "METHOD OF MANUFACTURING FORMED BODY FOR ELECTRODE"
}