LAYERED ELECTRODE BODY AND BONDING DEVICE FOR LAYERED ELECTRODE BODY

A layered electrode body manufacturing device comprising: a negative electrode cut drum cuts a negative electrode single plate at a first width, generates a negative electrode plate, and conveys same; a negative electrode heat drum heats the negative electrode plate; a positive electrode cut drum cuts a positive electrode single plate at a second width, generates a positive electrode plate, and conveys same; a positive electrode heat drum heats the positive electrode plate; and a bonding drum which positions the negative electrode plate on a first separator single plate, positions a second separator single plate thereon, and positions and bonds the positive electrode plate thereon. The pressing forces between the bonding drum, and the negative and positive electrode heat drums are adjusted. At least a portion of two sides from the outer edge part of the electrode plate is bonded to a separator, and the other two sides are not.