MULTI-SLOT DIE COATER WITH IMPROVED MANIFOLD

There is provided a multi-slot die coater including a manifold for a uniform flow of an electrode active material slurry without stagnation. The multi-slot die coater of the present disclosure includes a first manifold in which a first coating solution is received and a second manifold in which a second coating solution is received. The first manifold is a chamber of an inwardly recessed shape, and includes a first surface and a second surface having different angles to a lower slot at a location close to the lower slot, and the angle of the first surface closest to the lower slot is formed at a level of 30-70% of the second surface following the first surface.