{
  "$type": "site.standard.document",
  "description": "This document describes techniques and apparatuses including a solder joint damage-prevention mode for a computing device. In general, the computing device may enter the solder joint damage-prevention mode to transfer heat to solder joints and prevent failure mechanisms such as fracture, creep…",
  "path": "/patents/1323490",
  "publishedAt": "2022-07-28T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G06F11/008",
    "Google LLC"
  ],
  "textContent": "This document describes techniques and apparatuses including a solder joint damage-prevention mode for a computing device. In general, the computing device may enter the solder joint damage-prevention mode to transfer heat to solder joints and prevent failure mechanisms such as fracture, creep, and/or fatigue. The solder joint damage-prevention mode may rely upon one or more operations, including identifying a state of the computing device in or following which damage to the solder joints has an increased likelihood and, in response, activating a thermal-conditioning system. The thermal-conditioning system may, in general, increase a temperature of the solder joints to improve mechanical robustness of the solder joints.",
  "title": "Solder Joint Damage-Prevention Mode for a Computing Device"
}