SEAMLESS STITCHING FOR MULTI-RETICLE FABRICATION OF INTEGRATED PHOTONICS OPTICAL COMPONENTS

Aspects of the present disclosure are directed to fabrication of large-footprint chips having integrated photonic components comprising low-loss optical waveguides. The large footprint chips require the use of multiple reticles during fabrication. Stitching adjacent reticle fields seamlessly is accomplished by overlaying into adjacent reticle fields, tapering waveguide ends, and using strategically placed alignment marks in the die.