{
  "$type": "site.standard.document",
  "description": "[Object] To provide a sensor module that makes it possible to suppress generation of resin burrs and improve workability.[Solving Means] A sensor module (100) according to an embodiment of the present technology includes a sensor element, a first case (11), a second case (12), and a groove (70)…",
  "path": "/patents/1395792",
  "publishedAt": "2026-05-13T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B23K26/24",
    "SONY SEMICONDUCTOR SOLUTIONS CORP [JP]"
  ],
  "textContent": "[Object] To provide a sensor module that makes it possible to suppress generation of resin burrs and improve workability.[Solving Means] A sensor module (100) according to an embodiment of the present technology includes a sensor element, a first case (11), a second case (12), and a groove (70). The first case (11) includes an opening end including a first welded region and accommodates therein the sensor element. The second case (12) includes a joining surface (123) including a second welded region (50), the second welded region (50) being welded to the first welded region to form a welded portion. The groove (70) is formed in at least one of the first welded region or the second welded region (50).",
  "title": "SENSOR MODULE"
}