{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
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  "description": "This application discloses a power adapter and an electronic device system, and relates to the field of heat dissipation technologies. The power adapter includes a housing, a printed circuit board assembly, and insulation powder filled in the housing. The printed circuit board assembly is fastened…",
  "path": "/patents/1394189",
  "publishedAt": "2025-11-26T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60L53/14",
    "HUAWEI DIGITAL POWER TECH CO LTD [CN]"
  ],
  "textContent": "This application discloses a power adapter and an electronic device system, and relates to the field of heat dissipation technologies. The power adapter includes a housing, a printed circuit board assembly, and insulation powder filled in the housing. The printed circuit board assembly is fastened in the housing, and the insulation powder is used to conduct heat generated by the printed circuit board assembly to the housing. Compared with a thermally conductive adhesive, the insulation powder does not have a problem of poor fluidity, and can more easily be sufficiently filled. This solution improves heat dissipation effect of the power adapter and helps further increase a charging power of the power adapter.",
  "title": "POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM"
}