{
  "$type": "site.standard.document",
  "coverImage": {
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  "description": "In some embodiments, a method includes: selecting dimensions of a slot to be provided in a device feature, the dimensions selected to accommodate one or more tools while resulting in tangential contact between the slot and the one or more tools when the one or more tools are inserted into the slot…",
  "path": "/patents/1337745",
  "publishedAt": "2023-02-16T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M50/271",
    "Raytheon Canada Limited"
  ],
  "textContent": "In some embodiments, a method includes: selecting dimensions of a slot to be provided in a device feature, the dimensions selected to accommodate one or more tools while resulting in tangential contact between the slot and the one or more tools when the one or more tools are inserted into the slot and used to manipulate the device feature; and forming the slot in a surface of the device feature according to the selected dimensions.",
  "title": "IMPROVED SLOTTED DEVICE FEATURE"
}