{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreiexe6oz2nxrbij5mvo3ievarpwci5skicikloq47ozwkdwqtq275a"
    },
    "mimeType": "image/png",
    "size": 116237
  },
  "description": "One embodiment comprise: forming an annular recess on an upper surface of the lower wafer by etching, and a stem having a tip higher than a radially-outer-surface a generally center of the recess by etching the radially-outer-surface, which is a plane located radially outer side of the recess…",
  "path": "/patents/1393836",
  "publishedAt": "2025-11-26T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B81C1/00134",
    "TOKYO KEIKI INC [JP]"
  ],
  "textContent": "One embodiment comprise: forming an annular recess on an upper surface of the lower wafer by etching, and a stem having a tip higher than a radially-outer-surface a generally center of the recess by etching the radially-outer-surface, which is a plane located radially outer side of the recess; forming a plurality of first electrodes arranged on the radially-outer-surface; forming a sacrificial layer, which is an annular deposition pattern on the plurality of first electrodes; forming a plurality of second electrodes, which are arranged on a bottom surface of the upper wafer in correspondence with the plurality of first electrodes; bonding the upper wafer and the lower wafer with the sacrificial layer in between so that the plurality of first electrodes and the plurality of second electrodes are superimposed; separating a radially outer portion, which is located radially outer side of the upper wafer than the second electrodes by etching after the bonding; vacuum heating the upper wafer, the lower wafer, and the sacrificial layer are under a condition where a pressure in a cavity defined by the upper wafer, the lower wafer, and the sacrificial layer is different from an ambient pressure after the separating; and removing the sacrificial layer by etching, after the vacuum heating at the pressure different from the ambient pressure.",
  "title": "METHOD FOR MANUFACTURING CURVED SURFACE SUPPORT STRUCTURE, AND HEMISPHERICAL RESONATOR GYROSCOPE"
}