{
  "$type": "site.standard.document",
  "description": "The present disclosure provides a method for expanding a working area based on a laser map, a chip and a robot, and the method for expanding the working area includes using map pixel point information obtained by laser scanning to position pending boundary lines, deciding a next expansion of a…",
  "path": "/patents/1339181",
  "publishedAt": "2023-03-09T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G05D1/024",
    "AMICRO SEMICONDUCTOR CO.,LTD."
  ],
  "textContent": "The present disclosure provides a method for expanding a working area based on a laser map, a chip and a robot, and the method for expanding the working area includes using map pixel point information obtained by laser scanning to position pending boundary lines, deciding a next expansion of a rectangular working area according to an increment of a diagonal length of the rectangular working area framed by the pending boundary lines in a current expansion process, stopping expanding the rectangular working area of the robot when the increment of the diagonal length before expanding and after expanding reaches an overlap condition.",
  "title": "Method for Expanding Working Area Based on Laser Map, Chip and Robot"
}