{
  "$type": "site.standard.document",
  "description": "The present disclosure provides for electrical connectivity to high temperature film sensor devices (e.g., temperature sensor devices). More particularly, the present disclosure provides for high temperature, thin film sensor devices (e.g., temperature sensor devices) having connection of wires…",
  "path": "/patents/1392140",
  "publishedAt": "2025-09-03T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "F01D17/02",
    "UNIV OF RHODE ISLAND BOARD OF TRUSTEES [US]"
  ],
  "textContent": "The present disclosure provides for electrical connectivity to high temperature film sensor devices (e.g., temperature sensor devices). More particularly, the present disclosure provides for high temperature, thin film sensor devices (e.g., temperature sensor devices) having connection of wires (15A, 15B) and cabling (16) from the cold side (18) to the thin film sensor (28) on the hot side (20). The disclosure provides assemblies and methods for that electrical connection to the leads or traces (17A, 17B) of the thin film sensor device (e.g., thin film temperature sensor device such as a thermocouple or a resistance temperature detector device) at the hot-cold barrier that exists in high temperature components (e.g., high temperature components in aero turbine engine applications). The assemblies and methods of the disclosure can be applied to any thin film device (e.g., sensor devices, such as, for example, strain gauges, heat flux sensors, etc.) that can be applied to the surface of a high temperature component.",
  "title": "ELECTRICAL CONNECTIVITY TO HIGH TEMPERATURE FILM SENSOR DEVICES"
}