{
  "$type": "site.standard.document",
  "description": "A bonding method according to the present invention is a bonding method for bonding a bush to an adherend member and includes: an adhesive application step of applying an adhesive to a part of a buffer member, the part being bonded to the adherend member; a first heating step of heating a part of…",
  "path": "/patents/1390637",
  "publishedAt": "2025-08-20T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B29C65/02",
    "NHK SPRING CO LTD [JP]"
  ],
  "textContent": "A bonding method according to the present invention is a bonding method for bonding a bush to an adherend member and includes: an adhesive application step of applying an adhesive to a part of a buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.",
  "title": "BONDING METHOD"
}