{
  "$type": "site.standard.document",
  "description": "A chip for an optical gyroscope and an optical gyroscope with the chip. The chip includes a substrate having an upper surface; a first cladding layer immovably attached to the substrate; a waveguide core immovably attached to the first cladding layer; a second cladding layer immovably attached to…",
  "path": "/patents/1389607",
  "publishedAt": "2026-06-11T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G02B6/12007",
    "OSCPS MOTION SENSING INC."
  ],
  "textContent": "A chip for an optical gyroscope and an optical gyroscope with the chip. The chip includes a substrate having an upper surface; a first cladding layer immovably attached to the substrate; a waveguide core immovably attached to the first cladding layer; a second cladding layer immovably attached to the first cladding layer, the waveguide core being disposed between the first cladding layer and the second cladding layer; and a ring resonator core immovably attached to the substrate and having a side wall, the side wall of the ring resonator core forming an obtuse angle with the upper surface of the substrate. In some cases, the ring resonator core is disk shaped and made of doped silicon dioxide or silicon nitride.",
  "title": "CHIPS FOR OPTICAL GYROSCOPES"
}