{
  "$type": "site.standard.document",
  "description": "An outer packaging for electrical storage devices is composed of a laminate provided with at least a substrate layer, a barrier layer, an adhesive layer, and a thermally adhesive resin layer in this order, wherein the peak melting temperature for the thermally adhesive resin layer is observed at…",
  "path": "/patents/1347556",
  "publishedAt": "2023-07-13T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M50/126",
    "DAI NIPPON PRINTING CO., LTD."
  ],
  "textContent": "An outer packaging for electrical storage devices is composed of a laminate provided with at least a substrate layer, a barrier layer, an adhesive layer, and a thermally adhesive resin layer in this order, wherein the peak melting temperature for the thermally adhesive resin layer is observed at 130° C. or lower, the peak melting temperature for the adhesive layer is observed at 135° C. or higher, the resin constituting the thermally adhesive resin layer has a polyolefin skeleton, and the resin constituting the adhesive layer has a polyolefin skeleton",
  "title": "OUTER PACKAGING FOR ELECTRICAL STORAGE DEVICES, METHOD FOR MANUFACTURING SAID OUTER PACKAGING, AND ELECTRICAL STORAGE DEVICE"
}