INERTIAL MEASUREMENT MODULE AND UNMANNED AERIAL VEHICLE

Embodiments of the present invention is an inertial measurement module, including a mount, a circuit board, a thermally conductive member and a cover plate mounted to the mount. The circuit board is mounted to an end surface of the mount, and is configured to mount an inertial measurement assembly and the thermally conductive member. The inertial measurement assembly includes a thermal resistor and an inertial measurement unit. The thermally conductive member is configured to abut against the thermal resistor and the inertial measurement unit. A surface of the cover plate is provided with a first groove. A receiving space is formed by the first groove and the surface of the mount. The circuit board and the thermally conductive member are both received in the receiving space. The thermally conductive member is arranged at a preset distance from a bottom of the first groove.