{
  "$type": "site.standard.document",
  "description": "The present invention is directed to a method for assembling a semiconductor device and the resulting device, wherein the method comprising the steps of: a) Providing a lead frame (LF) that comprises a plurality of leads (LD1, LD2) and a pair of support parts (SPU). b) Disposing the lead frame (LF)…",
  "path": "/patents/945202",
  "publishedAt": "2016-04-06T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60L15/007",
    "RENESAS ELECTRONICS CORP [JP]"
  ],
  "textContent": "The present invention is directed to a method for assembling a semiconductor device and the resulting device, wherein the method comprising the steps of: a) Providing a lead frame (LF) that comprises a plurality of leads (LD1, LD2) and a pair of support parts (SPU). b) Disposing the lead frame (LF) above a chip mounting part (TAB) on which the semiconductor chip (CHP1) and the semiconductor chip (CHP2) have been mounted. c) Forming a conductive adhesive (ADH2) made of, for example, a silver paste or a high-melting-point solder on the anode electrode pads (ADP) of the semiconductor chips (CHP1, CHP2). d) Providing a clip (CLP) having the main body part (BDU) and a pair of extension parts (EXU) on opposite sides of said main body part (BDU). e) Mounting the clip (CLP) over the lead (LF) so that the clip (CLP) is supported by the pair of extension parts (EXU) and the main body part (BDU) at three different points. By using this method a conductive adhesive (ADH2) with an even layer thickness can be obtained. Thereby the thermal fatigue resistance of the semiconductor device can be improved.",
  "title": "SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF"
}