CONTROL APPARATUS

A control apparatus (100) in which a plurality of switch ICs (130) are disposed on a printed circuit board (150). Each of the switch ICs is an IC package including a semiconductor switch (131). [Objective] To perform overheat protection without making the configuration of an entire control apparatus excessively complex and without excessively increasing the area of a printed circuit board. [Means for Solution] Each of the switch ICs is disposed on the high-voltage side of a resistive load so as to drive the resistive load (300). An overheat prevention component (140)is provided and is in common connection with the plurality of switch ICs. The overheat prevention component includes a passive element (141) having a function of interrupting or limiting current flowing through the plurality of switch ICs in response to temperature rise. The plurality of switch ICs are disposed such that no switch IC is present between any of the switch ICs and the overheat prevention component.