{
  "$type": "site.standard.document",
  "description": "[Problem] An unintentional current path is formed between a broken semiconductor switch and a signal ground of a control apparatus, and an overcurrent flows therethrough. [Means for Solution] A control apparatus in which a switch IC is disposed on a printed circuit board is provided. The switch IC…",
  "path": "/patents/947567",
  "publishedAt": "2015-12-16T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "F02D41/28",
    "NGK SPARK PLUG CO [JP]"
  ],
  "textContent": "[Problem] An unintentional current path is formed between a broken semiconductor switch and a signal ground of a control apparatus, and an overcurrent flows therethrough. [Means for Solution] A control apparatus in which a switch IC is disposed on a printed circuit board is provided. The switch IC is an IC package including a semiconductor switch, and is provided on a high-voltage side of a resistive load so as to drive the resistive load. The printed circuit board has a signal ground connection wiring formed thereon. In this control apparatus, an overheat prevention component and an overcurrent prevention component are provided. The overheat prevention component is connected to the switch IC, and includes a first element having a function of interrupting or limiting current flowing through the switch IC in response to temperature rise. The overcurrent prevention component is connected to the signal ground connection wiring, and includes a second element having a function of interrupting overcurrent.",
  "title": "CONTROL APPARATUS"
}