{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreigbrjcqsnya5zwv5n3tmm6ll4rkazfbh4iyqfujsflf7uby35mvby"
    },
    "mimeType": "image/png",
    "size": 102045
  },
  "description": "A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of…",
  "path": "/patents/1353570",
  "publishedAt": "2023-10-26T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01L23/49575",
    "NXP USA, INC."
  ],
  "textContent": "A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.",
  "title": "SEMICONDUCTOR DEVICE WITH EMBEDDED BATTERY AND METHOD THEREFOR"
}