{
  "$type": "site.standard.document",
  "description": "The present invention relates to a wire-harness packaging member covering a conductive path, the wire-harness packaging member comprising a setting portion which is provided on an outer surface of the wire-harness packaging member so as to set an attachment position of a post-fitted part attached…",
  "path": "/patents/957949",
  "publishedAt": "2015-09-09T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60R16/0215",
    "YAZAKI CORP [JP]"
  ],
  "textContent": "The present invention relates to a wire-harness packaging member covering a conductive path, the wire-harness packaging member comprising a setting portion which is provided on an outer surface of the wire-harness packaging member so as to set an attachment position of a post-fitted part attached to the wire-harness packaging member, wherein the wire-harness packaging member is a tube body which is made of resin and which is provided with a mark portion as the setting portion when the tube body is molded out of the resin. Moreover, the present invention refers to a wire-harness comprising the inventive wire-harness packaging member, and a conductive path which is covered with the wire-harness packaging member.",
  "title": "Wire-harness packaging member, and wire harness"
}