{
  "$type": "site.standard.document",
  "description": "The performance of a sound insulation material in which chips (12) are utilized is improved. The sound insulation material includes a chip layer (21) containing many chips (12). The chip layer (21) is covered with a coat, and the chip layer (21) includes an unbreathable intermediate membrane layer…",
  "path": "/patents/960806",
  "publishedAt": "2015-05-13T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B32B5/245",
    "NISHIKAWA RUBBER CO LTD [JP]"
  ],
  "textContent": "The performance of a sound insulation material in which chips (12) are utilized is improved. The sound insulation material includes a chip layer (21) containing many chips (12). The chip layer (21) is covered with a coat, and the chip layer (21) includes an unbreathable intermediate membrane layer (27) dividing the chip layer (21) into a plurality of layers.",
  "title": "SOUNDPROOF MATERIAL"
}