SYSTEMS FOR DISSIPATING HEAT FROM VEHICLE-BASED DEVICES HAVING ELECTRONIC CIRCUITRY

Provided are example systems for dissipating heat from vehicle-based data processing components. In an example implementation, a heat dissipation device includes a heat sink, an enclosure configured to receive a device including electronic circuitry, a fan, and a flange extending along a periphery of the enclosure and/or the heat sink. The heat dissipation device is configured for insertion into an aperture of a wall of an interior compartment of a vehicle, such that the flange is positioned against the wall, at least a portion of the enclosure is positioned within the interior compartment of the vehicle, and at least a portion of the heat sink and the fan are positioned along an exterior of the vehicle.