{
  "$type": "site.standard.document",
  "description": "An inertial measurement device includes: a substrate having a joining area; a cap; a sensor device accommodated in a resin package and disposed in a mounting area on the substrate in an internal space between the substrate and the cap; and a sealing material and a joining material configured to…",
  "path": "/patents/1358642",
  "publishedAt": "2024-02-01T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G01C19/5712",
    "SEIKO EPSON CORPORATION"
  ],
  "textContent": "An inertial measurement device includes: a substrate having a joining area; a cap; a sensor device accommodated in a resin package and disposed in a mounting area on the substrate in an internal space between the substrate and the cap; and a sealing material and a joining material configured to join the cap to the substrate in the joining area of the substrate. The joining material surrounds the mounting area and has a communication hole for communication between the internal space and the outside, and the sealing material closes the communication hole.",
  "title": "Inertial Measurement Device And Method For Manufacturing Inertial Measurement Device"
}